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Baked my 360 to fix RROD
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gamexxover
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Post Posted: Thu Aug 28, 2008 4:36 am   
Post subject: Baked my 360 to fix RROD
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Powered up my 360 today and got the RROD, First time since I sent it in to get fixed about a year ago. I tried everything to find the problem but no luck, just red ring of death and no message on screen, I don't even have all the parts of the xbox as I keep it open to keep it nice and icy with an external fan.

So I got pissed and took it out to the garage to toss in the trash later or sell on eBay and just buy a newer one.

Then I remembered the RROD fix mentioned by some, where you wrap your xbox in a several towels to insulate it and trap the hot air in the machine, So I figured what the hell, I wrapped it up tight, left it on for about a little over 15 min, Unwrapped it, turned it back off, cooled it down with a fan for a few minutes, then powered it up, It worked great, just like new.

The towel trick worked for me, I don't know how exactly, some say it resets the chips or something, anyway I have been playing it all day with no problems.

If you do this make sure to take off the hard drive and all cables except power before wrapping.



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frozenfire1
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Post Posted: Thu Aug 28, 2008 5:25 am   
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The towel trick will work because it reflows the solder onto the chip/motherboard. But the x-clamps are still bent so it is only a temporary fix and will come back.

Best to get an x-clamp replacement then it should be gone for good, if you have any questions about it feel free to ask

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gamexxover
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Post Posted: Thu Aug 28, 2008 5:43 am   
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frozenfire12 wrote:
The towel trick will work because it reflows the solder onto the chip/motherboard. But the x-clamps are still bent so it is only a temporary fix and will come back.

Best to get an x-clamp replacement then it should be gone for good, if you have any questions about it feel free to ask


Thanks, If it continues to be a problem Ill get back to you on that. If so it should not be a big hassle to put them in, as my system is already opened up so Im half way there already lol.


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j8994
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Post Posted: Thu Aug 28, 2008 2:50 pm   
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frozenfire12 wrote:
The towel trick will work because it reflows the solder onto the chip/motherboard. But the x-clamps are still bent so it is only a temporary fix and will come back.

Best to get an x-clamp replacement then it should be gone for good, if you have any questions about it feel free to ask


actually from my testing the xbox 360 doesn't get hot enough inside during towel trick to melt or soften the solder.

all your doing when you do a towel trick / overheating / so called reflow is causing the board to swell.

if you really want a permanent fix get a used relow / smd reflow station and reflow using that or a heat gun. and then replace the xclamps as soon as you finish, making sure the board is still hot. i usually replace the xclamps with in seconds of reflowing with my reflow station.

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j8994
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Post Posted: Thu Aug 28, 2008 2:54 pm   
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this is the one i use

Rework/Reflow station

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gamexxover
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Post Posted: Thu Aug 28, 2008 6:58 pm   
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So is the basic problem causing the RROD'S "dry joint" ? Dry joint is where a wire/connection that is soldered to a board is cracked in a circle pattern so everything is in place but do to the slight crack in the solder around the connection the electricity can not flow, Usually caused by (from what i have heard) a combination of a poor amount of flux being used at initial soldering and the flexing of the mobo every time it heats up, sort of like stress fractures.


Also when you use a heat gun, are you trying to remelt the solder? also what area are you working, just under the chips or the whole board?


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gamexxover
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Post Posted: Thu Aug 28, 2008 7:10 pm   
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j8994 wrote:
this is the one i use

Rework/Reflow station


Cool machine, But I couldnt justify buying one of those unless I had more use for it than just my xbox, but if you were fixing many xbox's to make some extra cash it would be nice.


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deltaarmstrong2000
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Post Posted: Wed Sep 17, 2008 5:26 pm   
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I have a qustion on your reflowing j8994. I know the station works, so I'm not questioning that, but is it not better to wait until the board cools before doing the x-clamp? Would you not risk shifting the bga chip in the process of the x-clamp due to moving the board around?
Just curious.
Delta


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j8994
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Post Posted: Wed Sep 17, 2008 6:17 pm   
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no not that i have seen, the solder is already cool enough to keep them from shifting.
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