When you get your new fans, take a look into the back through the metal shroud and tell me how flat the motherboard is sitting. You will understand when you get to that point. And working with computers are a lot different due to the nature of space allowing air to flow over the needed components. When/if you remove the heatsinks you will also see how poorly machined the bottom the sinks are, so you better lap them as well while you are at it, not to mention put the thermal paste on the die head, not all around the dies. The springs don't lose their retention over time, you'll see when you remove them how they don't lay flat. Agreed that heat is a problem, but the flexing of the board, poorly machined faces of the heatsinks all come into play with the heat issue. It could have been controlled with better R&D. Now we are stuck fixing the problems. I personally don't think new fans will prevent it, just make the system have a less chance of getting two lights instead of three.
One other thing, as we both work on computers, you notice how badly the heatsinks get full of dust bunnies and we can just pull off the side panel to clean inside. Think of the extra air pulling in the dust now. It's a bigger pain to open the console and constantly clean the CPU heatsink because it's plugged. I'd invest the time and money into the fix before the fan personally, but that's me.
robbieboy 360-HQ Freak
Joined: May 15, 2006 Posts: 911
XP: 886
Posted: Sun Dec 28, 2008 8:32 pm Post subject:
deltaarmstrong2000 wrote:
When you get your new fans, take a look into the back through the metal shroud and tell me how flat the motherboard is sitting. You will understand when you get to that point. And working with computers are a lot different due to the nature of space allowing air to flow over the needed components. When/if you remove the heatsinks you will also see how poorly machined the bottom the sinks are, so you better lap them as well while you are at it, not to mention put the thermal paste on the die head, not all around the dies. The springs don't lose their retention over time, you'll see when you remove them how they don't lay flat. Agreed that heat is a problem, but the flexing of the board, poorly machined faces of the heatsinks all come into play with the heat issue. It could have been controlled with better R&D. Now we are stuck fixing the problems. I personally don't think new fans will prevent it, just make the system have a less chance of getting two lights instead of three.
One other thing, as we both work on computers, you notice how badly the heatsinks get full of dust bunnies and we can just pull off the side panel to clean inside. Think of the extra air pulling in the dust now. It's a bigger pain to open the console and constantly clean the CPU heatsink because it's plugged. I'd invest the time and money into the fix before the fan personally, but that's me.
No mate i'm with ya all the way when it comes to fixing them.....(you have some great idears)
i was just trying to give a realy easy way to help prevent RROD that's all.
and it's all about air flow..... and keeping it cool as you can.....
you like me have fixed like 20-30 xbox 360's so far and i'm with you mate they are put to gether so badly.......
and who knows WHY they put so much thermal paste all over the place thats as bad as not putting enough on...?
Well hopefully the new Jasper Xbox's are what we've been waiting for....
no more RROD.
OH X_Splinter
if you do just put the washers under the x-clamps DO NOT let the heatsink come away from the Die or you will have to repaste it....
saying that you might want to change the paste anyway.....
but put just enough to cover the Die..... _________________________________________________________
I know about the washer trick, the only problem is the standoff that are used from the factory are a bit too long, but most definitely sand,file or hammer those risers on the metal case. It'll save you in the long run, and even more with the Hana chips because they are BGA's, not pins like the Ana chips. Cursed solder balls under a chip. You would think after seeing all the problems with laptops they would go back to something repairable to re-flow, instead of risking the whole chip even with a re-flow machine.
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